Add a new cmdline to help diagnostic the bonding mode 4 in testpmd.
Show the lacp information about the bonded device and its slaves:
show bonding lacp info <bonded device port_id>
Signed-off-by: Chengchang Tang <tangchengchang@huawei.com>
Signed-off-by: Min Hu (Connor) <humin29@huawei.com>
Acked-by: Xiaoyun Li <xiaoyun.li@intel.com>
1dc6665d36