Michael Haeuptle 55df83ceb6 ENV_DPDK/VFIO: Increase PCI tear down timeout
When removing large number of devices (>8) in parallel,
the 20ms timeout is not long enough.

As part of spdk_detach_cb, DPDK calls into the VFIO driver
which may get delayed due to multiple hot removes being
processed by pciehp driver (pciehp IRQ thread function
is handling the actual removal of a device in paralle but
all of the IRQ thread function compete for a global mutex
increasing processing time and race conditions).

Signed-off-by: Michael Haeuptle <michael.haeuptle@hpe.com>
Change-Id: I470fbbee92dac9677082c873781efe41e2941cd5
Reviewed-on: https://review.spdk.io/gerrit/c/spdk/spdk/+/1588
Tested-by: SPDK CI Jenkins <sys_sgci@intel.com>
Reviewed-by: Darek Stojaczyk <dariusz.stojaczyk@intel.com>
Reviewed-by: Ben Walker <benjamin.walker@intel.com>
2020-04-03 06:31:40 +00:00
..
2020-03-19 08:50:45 +00:00
2018-11-30 19:59:34 +00:00